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Pemanfaatan Limbah Tahu Sebagai Media Adsorben Logam Berat Tembaga (Cu) Pada Limbah Elektroplating

Pemanfaatan Limbah Tahu Sebagai Media Adsorben Logam Berat Tembaga (Cu) Pada Limbah Elektroplating

Call Number : S 628.4 JAY p
Availability : 1 copies available for loan
Jurnal Teknik Industri

Jurnal Teknik Industri

Call Number : SER 338.005 JUR j
Availability : 1 copies available for loan